Engineering Notes
POWER RF AMPLIFIERS TECHNICAL REFERENCE MATERIAL
Cooling Methods
Empower RF employs a modular form of construction. Modules are cooled by conduction to a heatsink.
The mounting surfaces are machined to 63 micro-inches and 1 mil per inch TIR. Thermal compound is
applied to ensure minimum thermal resistance at the interface. Thermal overload protection is supplied on most
amplifiers.
Cooling can be accomplished four ways:
- Conduction - The amplifier baseplate is mounted to the heatsink. The heatsink must be designed
such that the maximum specified baseplate temperature is not exceeded, normally +71°C.
- Convection - The amplifier contains a very large finned heatsink. The surface area is large enough
to dissipate the heat in a still air environment.
- Forced Air - Cooling air is directed through a finned heatsink in the amplifier.
- Liquid - The cooling fluid is pumped through a chill plate in the amplifier.
The cooling heat exchanger is external to the amplifier.
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RF Glossary of Terms
RF Amplifiers Gain
Passband Frequency Range Gain Flatness
RF Power
Pulsed Power
Peak Envelope Power
Harmonics & Spurious
Intercept Point
Intermodulation Distortion
Multitone IMD Monograph
Noise Figure & Level
Modulation Types
VSWR & Return Loss (Impedance)
Load VSWR & Protection
Leveling Loops, Input Overdrive Protection
Graceful Degradation
Protection Circuits
DC Input Power & Efficiency
Cooling Methods
Class of RF Amplifiers
Class A Operation
Class AB Operation
Class C operation
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